Tag: TSV

BWI: Xilinx Stacked Silicon Interconnect Extends FPGA Technology to Deliver “More than Moore” Density, Bandwidth and Power Efficiency

Press release from Business Wire IndiaSource: Xilinx Thursday, October 28, 2010 08:50 PM IST (03:20 PM GMT)Editors: General: Consumer interest; Business: Advertising, PR & marketing, Business services, Information technology, Telecommunications; Technology————————————————–Xilinx Stacked Silicon Interconnect Extends FPGA Technology to Deliver “More than Moore” Density, Bandwidth and Power EfficiencyEnables 100x Improvement in

BWI: Xilinx Stacked Silicon Interconnect Extends FPGA Technology to Deliver “More than Moore” Density, Bandwidth and Power Efficiency

Press release from Business Wire IndiaSource: Xilinx Thursday, October 28, 2010 08:50 PM IST (03:20 PM GMT)Editors: General: Consumer interest; Business: Advertising, PR & marketing, Business services, Information technology, Telecommunications; Technology————————————————–Xilinx Stacked Silicon Interconnect Extends FPGA Technology to Deliver “More than Moore” Density, Bandwidth and Power EfficiencyEnables 100x Improvement in